Printed Circuit Board (PCB) Inspection
A significant role for industrial X-ray inspection systems is found in the inspection of printed circuit boards. Solder balls, broken leads, delaminating and defective metallization can be readily detected. Ball grid arrays regularly require inspection for incomplete metallization. Inspection systems often use microfocus X-ray sources and object rotation to obtain multi-dimensional images with variable magnification.
As microelectronics dimensions shrink, high resolution X-ray inspection of components becomes increasing vital for inspection of missing bond leads, die attach epoxy voids, component failures, and flip-chip solder joints.